저궤도 전자광학위성 탑재 적외선 카메라 신호처리보드의 열설계 및 열적 안정성 평가
Thermal design and Thermal stability evaluation ofInfrared camera Signal Process Board for LEO Electro-Optic satellite
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This paper presents the thermal design and reliability assessment of an Infrared camera Signal Processing Module (IRSPM) for low Earth orbit (LEO) electro-optic satellites. The IRSPM (352 × 196 × 113.5 mm, 5.13 kg) contains three Signal Processing Boards (SPB), three interface boards, and one power supply board. A geometric model was prepared in HyperMesh and a node based thermal mathematical model was implemented in Thermal Desktop and SINDA/FLUINT. Steady‑state analyses under an acceptance hot case boundary (+40°C base plate) included contact and lead thermal resistances. SPBs were modeled with 11 W dissipation per board for a 21‑minute active window. Initial results showed multiple EEE components exceeded ECSS derating limits, with a hotspot (U27) at 109.0°C. A targeted mitigation copper heat strap on U27 and SPB relocation toward the base plate was applied. Reanalysis reduced U27 peak temperature to 56.8°C (Δ ≈ 52.2°C) and restored derating margins to meet ECSS criteria. The study demonstrates that localized passive heat path enhancement and layout optimization effectively recover thermal margins for high density spacecraft electronics.
Abstract
This paper presents the thermal design and reliability assessment of an Infrared camera Signal Processing Module (IRSPM) for low Earth orbit (LEO) electro-optic satellites. The IRSPM (352 × 196 × 113.5 mm, 5.13 kg) contains three Signal Processing Boards (SPB), three interface boards, and one power supply board. A geometric model was prepared in HyperMesh and a node based thermal mathematical model was implemented in Thermal Desktop and SINDA/FLUINT. Steady‑state analyses under an acceptance hot case boundary (+40°C base plate) included contact and lead thermal resistances. SPBs were modeled with 11 W dissipation per board for a 21‑minute active window. Initial results showed multiple EEE components exceeded ECSS derating limits, with a hotspot (U27) at 109.0°C. A targeted mitigation copper heat strap on U27 and SPB relocation toward the base plate was applied. Reanalysis reduced U27 peak temperature to 56.8°C (Δ ≈ 52.2°C) and restored derating margins to meet ECSS criteria. The study demonstrates that localized passive heat path enhancement and layout optimization effectively recover thermal margins for high density spacecraft electronics.