폐 CPU 칩의 해체장치 제작 및 성능 평가
Manufacture of Dismantling Apparatus for Waste CPU Chip and Performance Evaluation
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초록
본 연구에서는 F-PGA 타입의 CPU 칩과 W-BGA 타입의 CPU 칩을 대상으로 금(Au)의 함량 및 분포 상태를확인하였다. 그 결과 F-PGA 칩의 경우, 금의 80.8%가 칩 터미널(terminal)부분에, W-BGA 칩의 경우에는 베어다이(bare die)에 금이 89.8% 편재되어 있는 것을 확인하였다. 이와 같이 대부분의 금이 칩의 특정 부분에 존재하는 사실로부터 CPU 칩의 해체장치를 고안하게 되었다. CPU 칩 해체실험의 조작변수는 롤러 회전속도, IR 히터의 가열온도, 가열 시간으로 하였다. F-PGA 칩의 경우에는 가열 온도 300o C, 가열 시간 90초 조건, 그리고 W-BGA 칩의경우에는 롤러속도 90 rpm, 가열온도 300o C, 가열 시간 180초 조건에서 칩 터미널과 베어다이를 각각 완전하게 분리/회수할 수 있었다.
Abstract
In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of 300o C and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of 300o C, the roller rotating rate of 90 rpm and the residence time of 90 s.
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