법랑질에 대한 total etching과 self-etching 접착제의 산부식 효과와 미세인장결합강도
Thed etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel
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Abstract
The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM), Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) was applied to the prepared teeth, and resin composite (Filtek Z250) was built up incrementally. Resin tag formation were evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test, resin-bonded teeth were trimmed to give a bonded surface area of 1mm2. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM; 26.55 MPa, SE; 18.15 MPa, LP; 15.57 MPa. SM had significantly higher microtensile bond strength than SE and PL (p < 0.05), but there was no significant differance between SE and PL.
참고문헌 (27)
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