임베디드 보드를 이용한 효율적인 시설물 내벽 크랙 감지 시스템의 설계

Abstract

Damage of the inner walls of a facility due to external factors such as earthquakes is not only difficult to diagnose but also includes visible crack. In the case of a crack detection system using a camera, blind spots were impossible to detect. Crack detection system which uses impedance characteristics and TDR which uses smart sheets didn't have blind spots, but had difficulties finding small cracks. Smart sheets were originally developed to detect damage of underground facilities, but it is possible to modify their form to attach them to the inside of the facility. The damage detection algorithm using impedance characteristics specified the damage location by filling the smart sheet with pulses of a certain length then measuring the time using the impedance discharge factor. However, this system's structure have to create approximation error between discharge start time and the measurement start time, which depends on warm-up situation and changes in the surrounding environment. In this paper, crack detection tape made with copper thin film is applied to the inner wall of the facility. The embedded system used one channel of ADS1015 to dataize detection pulses and reflected waves. Experiments and verification were conducted through simulated break testing after installing crack detection tape adapted for buildings using thin copper film tape on the walls of buildings. Collected the measured data to validate the enhanced crack detection system.