Bi-Al-Si-O와 Bi-Al-Si-O-F 유리 코팅막의 플라즈마 저항성
Plasma resistance of Bi-Al-Si-O and Bi-Al-Si-O-F glass coating film
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본 연구에서는 소결된 알루미나 기판에 코팅된 35Bi₂O₃-15Al₂O₃-50SiO₂ (BiAlSiO) and 35Bi₂O₃-7.5Al₂O₃-50SiO₂-7.5AlF₃ (BiAlSiOF) 유리층의 미세구조와 플라즈마 저항 특성이 소결 조건에 따라 어떻게 변화하는지를 조사하였다. 코팅된 층은 바 코팅 (bar Coating) 방법을 사용하여 형성되었으며, 이후 탈지 공정을 거쳐 반구 형성 온도 전/후인 700~900°C 범위의 온도에서 소결 되었다 . 내플라즈마성은 석영유리보다 두개의 코팅 유리가 약 2~3배 더 높았으며, F를 첨가한 BiAlSiOF는 BiAlSiO보다 높은 내플라즈성을 나타냈다. 이는 불소 첨가 효과로 판단된다. 소결 온도가 700°C에서 800°C로 증가함에 따라 두 유리 모두 내플라즈마성이 향상되었으나, 900°C까지 소결 온도를 증가시키면 내플라즈마성은 다시 감소한다 (즉, 식각률이 높아진다). 이러한 현상은 두 유리의 결정화 거동과 관련 깊은 것으로 판단된다. 소결 조건에 따른 내플라즈마성의 변화는 Al과 Bi-rich 상의 출현여부에 관련된 것으로 생각된다.
Abstract
In this study, the microstructure and plasma resistance characteristics of 35Bi₂O₃-15Al₂O₃-50SiO₂ (BiAlSiO) and 35Bi₂O₃-7.5Al₂O₃-50SiO₂-7.5AlF₃ (BiAlSiOF) glass layers coated on sintered alumina substrates were investigated according to the sintering conditions. The coated layers were formed using the bar coating method and then sintered at a temperature in the range of 700~900°C, which corresponds to the temperature before and after the hemisphere forming temperature, after a debinding process. The plasma resistance of the two coated glasses was approximately 2~3 times higher than that of the quartz glass, and in particular, the BiAlSiOF glass film with F added showed higher plasma resistance than BiAlSiO. It is thought to be due to the effect of suppressing the reaction with fluorine gas by adding fluorine to the glass. When the sintering time was increased at 700°C and 800°C, the plasma resistance of both glasses improved, but when the sintering temperature was increased to 900oC, the plasma resistance decreased again (i.e., the etching rate increased). This phenomenon is thought to be related to the crystallization behavior of both glasses. The change in plasma resistance depending on the sintering conditions is thought to be related to the appearance of Al and Bi-rich phases.
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