Influence of the SPS heating rate on the optical and mechanical properties of Y2O3-MgO nanocomposites
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Y2O3-MgO nanocomposites are promising materials for hypersonic infrared windows and domes due to their excellent mid-IR transmittance and mechanical properties. In this work, influence of SPS heating rate on the microstructure, IRtransmittance, and mechanical properties of Y2O3-MgO nanocomposites was investigated. It was found that the average grainsize decreases with a decreasing heating rate, which can be attributed to high defect concentration by rapid heating anddeformation during densification. Also, the residual porosity decreases with a decreasing heating rate, which is ascribed to theenhancement of grain boundary diffusion by a large grain-boundary area (a small grain size). Consequently, hightransmittance and hardness were attained by the low heating rate. On the other hand, the mechanical strength showed littledifference with the heating rate change, which is somewhat different from the general knowledge on ceramics and will bediscussed in this letter
Abstract
Y2O3-MgO nanocomposites are promising materials for hypersonic infrared windows and domes due to their excellent mid-IR transmittance and mechanical properties. In this work, influence of SPS heating rate on the microstructure, IRtransmittance, and mechanical properties of Y2O3-MgO nanocomposites was investigated. It was found that the average grainsize decreases with a decreasing heating rate, which can be attributed to high defect concentration by rapid heating anddeformation during densification. Also, the residual porosity decreases with a decreasing heating rate, which is ascribed to theenhancement of grain boundary diffusion by a large grain-boundary area (a small grain size). Consequently, hightransmittance and hardness were attained by the low heating rate. On the other hand, the mechanical strength showed littledifference with the heating rate change, which is somewhat different from the general knowledge on ceramics and will bediscussed in this letter
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