Structural and physical properties of bulk Ni-B alloys processed through powder metallurgy
1
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Bulk Ni-B alloys with different boron contents of 3, 6, 9 and 12 wt.% were fabricated by a combination of mechanical alloying and hot-pressing of Ni and B powders as starting materials. The various structural phase evolutions depending on the boron contents and processing time were monitored from X-ray diffraction profiles. The core-level and valence-band spectra of the Ni-B alloys based on X-ray photoelectron spectroscopy showed that they were remaining metallic phases within the studied compositions. Furthermore, these materials showed the relatively low electrical resistivities, 1 to 10 (10−3 Ω/m) at a wide range of temperature (25-500 ℃). On the other hand, the thermal diffusivities of these materials were ranged from 2.5 to 7 (10−6 m2 / s), which are markedly lower than that of the conventional metallic materials and similar to those for engineering ceramics. The relatively low thermal conductivities are likely the result of a phonon scattering induced by their fine microstructures.
Abstract
Bulk Ni-B alloys with different boron contents of 3, 6, 9 and 12 wt.% were fabricated by a combination of mechanical alloying and hot-pressing of Ni and B powders as starting materials. The various structural phase evolutions depending on the boron contents and processing time were monitored from X-ray diffraction profiles. The core-level and valence-band spectra of the Ni-B alloys based on X-ray photoelectron spectroscopy showed that they were remaining metallic phases within the studied compositions. Furthermore, these materials showed the relatively low electrical resistivities, 1 to 10 (10−3 Ω/m) at a wide range of temperature (25-500 ℃). On the other hand, the thermal diffusivities of these materials were ranged from 2.5 to 7 (10−6 m2 / s), which are markedly lower than that of the conventional metallic materials and similar to those for engineering ceramics. The relatively low thermal conductivities are likely the result of a phonon scattering induced by their fine microstructures.
참고문헌 (23)
- V. Tennery, "Science of Hard Materials", pp.891~909 (1983), Plenum
- V.I. Matkovich, "Boron and refractory borides" (1977), Springer
- C. Mrozl, , AM. CERAM. SOC. BULL, 74(6), pp.158~159 (1995)
- R. Cutlerl, "Engineered Materials Handbook Volume 4:Ceramics and Glasses", ASM International, pp.787~803 (1991)
- K. Sakail, , J. CERAM. SOC. JPN, 24, pp.526~532 (1989)
- G.V. Samsonov, "Boron, its compounds and alloys" (1962), U.S. Atomic Energy Commission, Division of Technical Information
- D. Baudrand, , MET. FINISH, 93(9), pp.55~57 (1995)
- F. Delaunois, , Surf. Coat. Technol, 160(2), pp.239~248 (2002)
- C. Dervos, , Mater. Lett, 58(5), pp.619~623 (2004)
- B. Mahdavi, , Can. J. Chem, 74(3), pp.380~388 (1996)
- D. Hua, , Int. J. Hydrogen. Energy, 28(10), pp.1095~1100 (2003)
- A.V. Paustovskii, , POWDER.METALL.MET.C+, 43(1-2), pp.94~98 (2004)
- P. S. Kumar, , NANOSTRUCT. MATER, 4(2), pp.183~198 (1994)
- A.I.H. Committee, "ASM Handbook Volume 5: Surface Engineering" (1994), ASM International
- L. Battezzati, , J. ALLOY. COMPD, 247(1), pp.164~171 (1997)
- C. Koch, "Processing of metals and alloys", pp.193~245 (1991)
- C. Kochl, , MAT. SCI. ENG. A-STRUCT, 244(1), pp.39~48 (1998)
- S. Hüfner, , PHYS. REV. B, 8(10), pp.4511~4524 (1973)
- S. -P. Lee, , J. Mol. Catal. A. Chem, 152(1), pp.213~223 (2000)
- E. Il’Inchikl, , J. Appl. Spectrosc, 75(6), pp.883~891 (2008)
- S. Howlett, , J. Mater. Sci. Lett, 4(2), pp.227~229 (1985)
- G. Ziegler, , J. MATER. SCI, 16(2), pp.495~503 (1981)
- F.J. Blatt, "Physics of electronic conduction in solids" (1968), McGraw-Hill