Experimental investigations of machining characteristics of SiC in high speed plunge grinding
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Grinding is widely used as a productive technique for finishing ceramic components in the manufacturing industry. However,it is still difficult to achieve a satisfying finishing quality for scarce of comprehensive engineering investigations of damage-freeand economical techniques of advanced ceramics. This paper will utilize a high speed grinder to develop the grinding forces,temperature, grinding surface and subsurface features in high speed plunge grinding of SiC. The ductile grinding of SiC undera relatively high grinding speed will be investigated. A set of detecting equipment, including a rotating dynamometer and agrindable thermocouple, will be used to measure the online grinding forces and temperature. Besides, the subsurface damage,chips and ground surface will be examined by SEM micrographs. It has been found that ductile grinding of SiC can beachieved through a combination of the increase of the wheel speed and the control of grinding parameters. Via causing lowerforce and thermal effects, the critical value for ductile grinding of SiC can be greatly improved under high speed grindingcomparing to conventional speed grinding. Moreover, the grinding subsurface integrity will not be adversely effected thoughimproving material removal volumes under high speed grinding.
Abstract
Grinding is widely used as a productive technique for finishing ceramic components in the manufacturing industry. However,it is still difficult to achieve a satisfying finishing quality for scarce of comprehensive engineering investigations of damage-freeand economical techniques of advanced ceramics. This paper will utilize a high speed grinder to develop the grinding forces,temperature, grinding surface and subsurface features in high speed plunge grinding of SiC. The ductile grinding of SiC undera relatively high grinding speed will be investigated. A set of detecting equipment, including a rotating dynamometer and agrindable thermocouple, will be used to measure the online grinding forces and temperature. Besides, the subsurface damage,chips and ground surface will be examined by SEM micrographs. It has been found that ductile grinding of SiC can beachieved through a combination of the increase of the wheel speed and the control of grinding parameters. Via causing lowerforce and thermal effects, the critical value for ductile grinding of SiC can be greatly improved under high speed grindingcomparing to conventional speed grinding. Moreover, the grinding subsurface integrity will not be adversely effected thoughimproving material removal volumes under high speed grinding.
참고문헌 (24)
- S. Malkin, "Grinding mechanisms for Ceramics", CIRP Annals-Manufacturing Technology, 45(2), pp.569~580 (1996)
- Jianyi Chen, "Grinding characteristics in high speed grinding of engineering ceramics with brazed diamond wheels", Journal of Materials Processing Technology, 210, pp.899~906 (2010)
- S. Agarwal, "Grinding characteristics, material removal and damage formation mechanism s in high removal rate grinding of silicon carbide", International Journal of Machine Tools & Manufacture, 50, pp.1077~1087 (2010)
- Siva Venkatachalam, "Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials", journal of materials processing technology (2008)
- K. Kitajima, "Study on Mechanism of Ceramics Grinding", CIRP Annals-Manufacturing Technology, 41(1), pp.367~371 (1992)
- T.G Bifano, "Ductile-regime grinding: A new technology for machining brittle materials", Journal of Engineering for Industry Transactions of the ASME, 113(2), pp.184~189 (1991)
- F. Klocke, "Machining of Ceramics and Composites", pp.119~138 (1999), Marcel Dekker
- Ling Yina, "High speed versus conventional grinding in high removal rate machining of alumina and alumina-titania", International Journal of Machine Tools & Manufacture, 45, pp.897~907 (2005)
- L.Yin, "Ceramic Response to High Speed Grinding", Machining Science and Technology, 8, pp.21~37 (2008)
- Jiaming Ni, "Phase transformation in high-speed cylindrical grinding of SiC and its effects on residual stresses", Materials Letters, 89, pp.150~152 (2012)
- T.G Bifano, "Ductile-regime grinding: A new technology for machining brittle materials", Journal of Engineering for Industry Transactions of the ASME, 113(2), pp.184~189 (1991)
- H. Huang, "Grinding Characteristics of Engineering Ceramics in High Speed Regime", International Journal of Abrasive Technology, 1, pp.78~93 (2007)
- C.J. Salomon, "Process for machining metals of similar acting materials when being worked by cutting tools, German patent, Number 523594, 1931", ~
- H. Schultz, "High speed milling of aluminium alloys", Proceedings of the Winter Annual Meeting of the ASME, pp.241~244 (1984)
- D. O’Sullivan, "Temperature measurement in single point turning", Journal of Materials Processing Technology, 118, pp.301~308 (2001)
- M. Hitchiner, "Practical challenges to the application of high wheel speeds to grinding", Proceedings of an International Technical Conference on Diamond, cubic boron nitride and their applications (2003), Industrial Diamond Association of America
- F. Klocke, "High-Speed Grinding-Fundamentals and State of the Art in Europe, Japan and the USA", CIRP Ann-Manuf. Techn, 46(2), pp.715~724 (1997)
- Mingjun Chen, "The critical conditions of brittle–ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding", Journal of Materials Processing Technology, 168(1), pp.75~82 (2005)
- H. Huang, "Experimental investigations ofmachining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding", International Journal of Machine Tools and Manufacture, 43(8), pp.811~823 (2003)
- A Feasibility Investigation of High Speed, Low Damage Grinding for Advanced Ceramics, "J.A.Kovach", Society of Manufacturing Engineers, ~, pp.MR93-352 (1993)
- Han Huang, "High speed grinding of silicon nitride with resin bond diamond wheels", Journal of Materials Processing Technology, 141(3), pp.329~336 (2003)
- A.D. Batako, "Temperature measurement in high efficiency deep grinding", International Journal of Machine Tools & Manufacture, 45, pp.1231~1245 (2005)
- H.H.K.Xu, "Simple technique for observing subsurface damage in machining of ceramics", Journal of American Ceramics Society, 77, pp.1388~1390 (1994)
- F. Klocke, "Coolant Induced Forces in CBN High Speed Grinding with Shoe Nozzles", CIRP Annals-Manufacturing Technology, 49(1), pp.241~244 (2000)