LCD TV 해체 시 발생하는 PCB의 효율적 재활용을 위한구조 분석 및 등급별 분류
Efficient Recycling of Printed Circuit Boards from Disassembly/Separation Process of waste LCD TVs: Composition Analysis and Value-wise Classification
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
재활용을 위한 LCD TV 분해 시 영상 신호 송신, 전원 공급, 화상 구현 등을 위한 다양한 종류의 PCB가 발생한다. PCB에는금이나 구리와 같은 유가금속이 다량 함유 되어 있으나 사용용도, PCB 패키징 방법에 따라 함유 되어 있는 유가금속의 종류와 함유량에 차이가 있다. 본 연구에서는 PCB 종류에 따른 구조 분석을 통하여 PCB에 함유 된 금과 구리의 함유량에 따라 PCB를 등급별로 분류 하고자 하였으며 금 회수 효율이 높은 PCB, 금 회수 효율이 낮은 PCB, 금이 함유되어 있지 않은 PCB 세 종류로 분류를 하였다. 또한 실제 LCD TV를 분해하여 발생된 PCB에 대한 함유량 분석을 통하여 PCB 내 금과 구리 함유량을 분석하였다.
Abstract
Various waste PCBs arose during disassembly of LCD TVs and monitors in which they originally functioned for transmissionof imaging signal, power supply, and imaging control. In those functional PCBs, gold and copper are contained at far moreacceptable level, exceeding mining grade ores. Those valuable metals and their contents widely vary with functionality and enduse of PCBs. Therefore, compositional analysis of individual waste PCBs from disassembled LCD TVs and monitors were performedin the present study to classify them into three categories: high gold yield and low gold yield PCBs and those withoutgold contents. Besides, additional chemical analysis was made to reveal gold and copper contents in the waste PCBs arising fromactual disassembly/separation of end-of-life LCD TVs and monitors.
참고문헌 (11)
- George Milad, "Surface finishes in a lead-free world", Circuit World, 34(4), pp.4~7 (2008)
- Martin Goosey, "Recycling technologies for the treatment of end of life printed circuit boards (PCBs)", Circuit World, 29(3), pp.33~37 (2003)
- C. Eswaraiah, "Classification of metals and plastics from printed circuit boards (PCB) using air classifier", Chemical Engineering and Processing, 47, pp.565~576 (2008)
- T. Kinoshita, "Metal recovery from nonmounted printed wiring boards via hydrometallurgical processing", hydrometallurgy, 69, pp.73~79 (2003)
- ROHM AND HAAS ELECTRONIC MATERIALS, "Why Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)?", Technical Communications, ~ (2008)
- Chun Hsien Fu, "Investigation of IMC growth and solder joint reliability on new surface finish-ENEPIG, Microsystems, Packaging, Assembly and Circuits Technology, 2007", IMPACT 2007. International, pp.331~334 (2007)
- Lu, Su-Tsai, "Thin electroless Cu", OSP on electroless Ni as a novel surface finish for flip chip solder joints, 2006, 119~124
- Chan-Sei Yoo, "Chip inductor technology trends", Electronic Parts & Components, 119, pp.53~60 (2004)
- Jung Rag Yoon, "MLCC(Multilayer Chip Capacitor)technology and market trends", Electronic Parts &Components, 221, pp.58~65 (2006)
- Lu, Su-Tsai, "A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultrafine pitch", Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, pp.1544~1551 (2009)
- Aschenbrenner, Rolf, "Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps., Components, Packaging, and Manufacturing Technology, Part C", IEEE Transactions on, 20(2), pp.95~100 (1997)
