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SAW 소자 응용을 위한 실리콘 기판 위에 AlN 박막의 최적 증착 조건에 관한 연구

Optimum deposition conditions of AlN thin film on the Si substrate for SAW application

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주제분류공학일반

초록

Abstract

AlN thin film for SAW filter application was deposited on (10) silicon wafers by reactive magnetron sputtering method.The structural characteristics were de deposition conditions such as sputtering pressure, RF power, substratetemperature, and nitrogen partial pressure. Scanning Electron Microscope (SEM), X-ray Diffraction (XRD), Electron ProbeMicroAnalyzer (EPMA) and Atomic Force Microscope (AFM) have been used to find out structural properties andprefered orientation of AlN thin films. Insertion los of SAW devices was 28.51 dB and out of band rejection was about24 dB.

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