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재활용 가능한 고방열 고분자 복합소재 개발

Recyclable Polymeric Composite with High Thermal Conductivity

김두헌|김채빈|고문주|임종국|안석훈|신하은
한국복합재료학회 (The Korean Society For Composite Materials)|2019.12|Composites Research|제32권 제6호|pp. 319-326

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키워드

복합재료Composite materialThermal conductivityHexagonal boron nitride열전도도육방정 질화붕소Polymer matrix고분자 수지
주제분류재료공학

초록

본 연구에서는 재활용이 가능하며 열가소성 특성을 지닌 신규 고분자 수지를 개발하고 합성하였다. 이렇게 개발된 수지와 판상형 질화붕소(h-BN) 사이의 계면 친화성이 좋음을 계산과학을 통하여 확인하고 열압기(hot press)를 이용하여 복합소재를 제조하였다. 고분자 수지와 필러 사이의 계면 친화성과 함께 복합소재 제조시 발생되는 전단력(shear force) 만으로도 매우 높은 필러 정렬도를 지닌 복합소재를 제조할 수 있었고, 이러한 이유로 복합소재는 최대 13.8 W/mK의 높은 열전도도를 갖는 것을 확인하였다. 또한, 개발된 수지가 화학적으로 분해 가능한 장점을 이용하여 제조된 복합소재로부터 물리/화학적 변성 없이 필러를 회수할 수 있었고 이렇게 회수된 필러는 향후 다양한 신규 복합소재 제조에 재활용이 가능하다.

Abstract

To address tremendous needs for developing efficiently heat dissipating material with lightweights, a new class of polymer possessing recyclable and malleable characteristics was synthesized for incorporating model functional hexagonal boron nitride (h-BN) filler. A good interfacial affinity between the polymer matrix and the filler along with shear force generated upon manufacturing the composite yielded the final product bearing highly aligned filler via simple hot pressing method. For this reason, the composite exhibited a high thermal conductivity of 13.8 W/mK. Moreover, it was possible to recover the h-BN from the composite without physical/chemical denaturation of the filler by chemically depolymerizing the matrix, thus the recovered filler can be re-used in the future. We believe this polymer could be beneficial as matrix for incorporating many other functional fillers, thus they may find applications in various polymeric composite related fields.

참고문헌 (37)

  1. Moore, G. E., "Cramming More Components onto Integrated Circuits", Proceedings of the IEEE, 6(1), pp.82~85 (1998)
  2. Bates, C. M., "Block Copolymer Lithography", Macromolecules, 47(1), pp.2~12 (2014)
  3. Kim, S. O., "Epitaxial Self Assembly of Block Copolymers on Lithographically Defined Nanopatterned Substrates", Nature, 424, pp.411~414 (2003)
  4. Stoykovich, M. P., "Directed Assembly of Block Copolymer Blends into Nonregular Device-Oriented Structures", Science, 308(5727), pp.1442~1446 (2005)
  5. Ruiz, R., "Density Multiplication and Improved Lithography by Directed Block Copolymer Assembly", Science, 321(5891), pp.936~939 (2008)
  6. Moore, A. L., "Emerging Challenges and Materials for Thermal Management of Electronics", Materials Today, 17(4), pp.163~174 (2014)
  7. Prasher, R., "Thermal Interface Materials : Historical Perspective, Status, and Future Directions", Proceedings of the IEEE, 94(8), pp.1571~1586 (2006)
  8. Wong, C. P., "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging", Journal of Applied Polymer Science, 74, pp.3396~3403 (1999)
  9. Kang, D. G., "Interfacial Engineering for the Synergistic Enhancement of Thermal Conductivity of Discotic Liquid Crystal Composites", ACS Applied Materials & Interfaces, 10(4), pp.3155~3159 (2018)
  10. Jeong, I., "Liquid Crystalline Epoxy Resin with Improved Thermal Conductivity by Intermolecular Dipole-Dipole Interactions", Journal of Polymer Science Part A : Polymer Chemistry, 57(6), pp.708~715 (2019)
  11. Yeo, H., "Characteristic Correlation between Liquid Crystalline Epoxy and Alumina Filler on Thermal Conducting Properties", Composites Science and Technology, 141, pp.99~105 (2017)
  12. Islam, A Md., "Enhanced Thermal Conductivity of Liquid Crystalline Epoxy Resin using Controlled Linear Polymerization", ACS Macro Letters, 7(10), pp.1180~1185 (2018)
  13. Xu, X., "Thermal Conductivity of Polymers and Their Nanocomposites", Advanced Materials, 30(17), pp.1705544~ (2018)
  14. Kim, C. B., "Thermal Conductivity Enhancement of Reduced Graphene Oxide via Chemical Defect Healing for Efficient Heat Dissipation", Carbon, 139, pp.386~392 (2018)
  15. Lee, J., "Optimizing Filler Network Formation in Poly(hexahydrotriazine)for Realizing High Thermal Conductivity and Low Oxygen Permeation", Polymer, 179, pp.121639~ (2019)
  16. Jiang, Q., "Mechanical, Electrical and Thermal Properties of Aligned Carbon Nanotube", Polyimide Composites, 2014, pp.56, 408~412
  17. Zhu, H., "Highly Thermally Conductive Papers with Percolative Layered Boron Nitride Nanosheets", ACS Nano, 8(4), pp.3606~3613 (2014)
  18. Song, W. L., "Polymer", Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance, 2012, pp.51(26), 6498~6501
  19. Lin, Z., "Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix : Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation", ACS Applied Materials & Interfaces, 5(15), pp.7633~7640 (2013)
  20. Yuan, C., "Thermal Conductivity of Polymer Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets", ACS Applied Materials & Interfaces, 7(23), pp.13000~13006 (2015)
  21. Yousefi, N., "Self-alignment and High Electrical Conductivity of Ultralarge Graphene Oxide-Polyurethane Nanocomposites", Journal of Materials Chemistry, 22(25), pp.12709~12717 (2012)
  22. Liang, Q., "A Threedimensional Vertically Aligned Functionalized Multilayer Graphene Architecture : An Approach for Graphene-based Thermal Interfacial Materials", ACS Nano, 5(3), pp.2392~2401 (2011)
  23. Erb, R. M., "Composites Reinforced in Three Dimensions by using Low Magnetic Fields", Science, 355(6065), pp.199~204 (2012)
  24. Erb, R. M., "Magnetic Assembly of Colloidal Superstructures with Multipole Symmetry", Nature, 457, pp.999~1002 (2009)
  25. Lanticse, L. J., "Shear-induced Preferential Alignment of Carbon Nanotubes Resulted in Anisotropic Electrical Conductivity of Polymer Composites", Carbon, 44(14), pp.3078~3086 (2006)
  26. Terao, T., "Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement", Journal of Physical Chemistry C, 114(10), pp.4340~4344 (2010)
  27. Jan, R., "Enhancing the Mechanical Properties of BN Nanosheet-Polymer Composites by Uniaxial Drawing", Nanoscale, 6(9), pp.4889~4895 (2014)
  28. Haggenmueller, R., "Aligned Single Wall Carbon Nanotubes in Composites by Melt Processing Methods", Chemical Physics Letters, 330(3-4), pp.219~225 (2000)[DOI]
  29. Shin, H., "Recyclable Thermoplastic Hexagonal Boron Nitride Composites with High Thermal Conductivity", Composites Part B: Engineering, 163, pp.723~729 (2019)
  30. García, J. M., "Recyclable, Strong Thermosets and Organogels via Paraformaldehyde Condensation with Diamines", Science, 344(6185), pp.732~735 (2014)
  31. Kaminker, R., "Solvent-free Synthesis of High-performance Polyhexahydrotriazine(PHT)Thermosets", Chemistry of Materials, 30(22), pp.8352~8358 (2018)
  32. Lei, H., "Tunable and Processable Shape-Memory Materials Based on Solvent-Free Catalyst-Free Polycondensation between Formaldehyde and Diamine at Room Temperature", ACS Macro Letters, 8(5), pp.582~587 (2019)
  33. Ho, M. -P., "Interfacial Bonding and Degumming Effects on Silk Fibre", Polymer Biocomposites, 2012, pp.43, 2801~2812
  34. Lu, T., "Effect of Surface Modification of Bamboo Cellulose Fibers on Mechanical Properties of Cellulose", Epoxy Composites, 2013, pp.51, 28~34
  35. Nielsen, L. E., "Generalized Equation for the Elastic Moduli of Composite Materials", Journal of Applied Physics, 41(11), pp.4626~4627 (1970)
  36. Tanimoto, M., "Anisotropic Thermal Diffusivity of Hexagonal Boron Nitride-filled Polyimide Films : Effects of Filler Particle Size, Aggregation, Orientation, and Polymer Chain Rigidity", ACS Applied Materials & Interfaces, 5(10), pp.4374~4382 (2013)
  37. Lee, K. H., "Large-scale Synthesis of High-quality Hexagonal Boron Nitride Nanosheets for Large-Area Graphene Electronics", Nano Letters, 12(2), pp.714~718 (2012)

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