본문 바로가기
KERD
논문KCI 등재

테라헤르츠 중첩 신호의 FWHM 분석을 통한 유리섬유 복합재료 내부 미세 박리 검출 기술

Detection of Fine Delamination in Glass Fiber Reinforced Polymer Analyzing Full Width Half Maximum of Superimposed Terahertz Signal

2

조회

0

다운로드

1

인용

0

참고문헌

키워드

주제분류재료공학

초록

유리섬유 복합재료(GFRP) 내부 미세 박리에서 나타나는 테라헤르츠(THz) 중첩 신호의 FWHM 분석을 통한 미세 박리 검출 기술을 연구하였다. 테라헤르츠 시간영역 분광(THz-TDS) 시스템의 반사모드를 통해 유리섬유 복합재료 내부의 미세 박리 크기 별 THz 신호를 측정하였고, 미세 박리 위치에서 반사되어 검출되는 THz 중첩 신호의 Full Width Half Maximum (FWHM) 값을 추출하였다. 이후, 유리섬유 복합재료의 복소굴절률을 측정하여 미세 박리 크기에 따른 미세 박리 위치에서의 THz 중첩 신호 및 FWHM 값을 계산하여 비교하였다. 이론적으로 계산된 THz 중첩 신호로부터 미세 박리 크기와 중첩 신호에서의 FWHM 값의 상관관계를 도출하였으며, 미세 박리위치에서의 THz 신호로부터 추출된 FWHM의 분석을 통해 미세 박리 크기를 예측할 수 있었다.

Abstract

Full width half maximum (FWHM) analysis of superimposed terahertz (THz) signals in the glass fiber reinforced polymer (GFRP) was studied to detect fine delamination inside GFRP. The THz signals were measured for each fine delamination size inside the GFRP using the reflection mode of the terahertz time domain spectroscopy (THz-TDS) system. Then, the FWHM of the superimposed THz signal reflected at the fine delamination wasextracted. Thereafter, the complex refractive index of the GFRP was measured using transmission mode of the THz-TDS system. Based on this, the FWHM of the superimposed THz signal at the fine delamination were calculated and compared with respect to the fine delamination size. From the theoretically calculated superimposed signals, the relationship between the fine delamination size and the FWHM in the superimposed THz signal was derived. Consequently, the fine delamination size could be predicted through the analysis of the FWHM extracted from theTHz signal at the fine delamination.

참고문헌 (7)

  1. Palanikumar, K., "Evaluation of Delamination in Drilling GFRP Composites", Materials and Manufacturing Processes, 23(8), pp.858~864 (2008)
  2. Yang, R. S. H., "An Automated Ultrasonic Inspection Approach for Flip Chip Solder Joint Assessment", Microelectronics Reliability, 52(12), pp.2995~3001 (2012)
  3. Wang, F., "Void Detection in TSVs with X-ray Image Multithreshold Segmentation and Artificial Neural Networks", IEEE Transactions on Components, Packaging and Manufacturing Technology, 4(7), pp.1245~1250 (2014)
  4. 김도형, "Nondestructive Evaluation of Hidden Damages in Glass Fiber Reinforced Plastic by Using the Terahertz Spectroscopy", International Journal of Precision Engineering and Manufacturing-Green Technology, 4(2), pp.211~219 (2017), 한국정밀공학회[DOI]
  5. Ryu, C. -H., "Nondestructive Evaluation of Hidden Multi-delamination in a Glass-fiber-reinforced Plastic Composite Using Terahertz Spectroscopy", Composite Structures, 156, pp.338~347 (2016)
  6. Park, D. -W., "In-situ Thickness Measurement of Epoxy Molding Compound in Semiconductor Package Products Using a Terahertz-Time of Flight System", NDT & E International, 105, pp.11~18 (2019)
  7. 진윤식, "Terahertz Dielectric Properties of Polymers", Journal of the Korean Physical Society, 49(2I), pp.513~517 (2006), 한국물리학회

관련 논문AI추천

이 간행물의 다른 논문 (8건)