Quantum annealing을 통한 hybrid composite의 두께 방향 열전도 특성 개선
Improving Through-thickness Thermal Conductivity Characteristic of Hybrid Composite with Quantum Annealing
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초록
본 연구에서는 탄소섬유 강화 플라스틱(CFRP)에 얇은 구리 필름(Cu film)이 배치된 hybrid composite이 제안되었으며, 두께 방향 열전도도가 최대가 될 수 있는 Cu film 배치 조합을 도출하는데 양자 어닐링(Quantum Annealing)이 적용되었다. CFRP의 각 ply와 Cu film간의 상관관계 분석이 유한요소 해석을 통해 수행되었으며, 수행된 결과를 바탕으로 조합 최적화 문제가 정의되었다. 정의된 문제를 양자 어닐링에 임베딩하기 위한 공식화 과정이 진행되었으며 이를 통해 CFRP의 각 ply에 투입될 수 있는 Cu film 수량에 관한 목적함수와 제약조건이 수식으로 구현되었다. 공식화된 수식은 D-Wave 양자 어닐러에 임베딩되기 위해 Ocean SDK(software development kit)와 Leap을 통해 프로그래밍 되었으며, 양자 어닐링 과정을 통해 두께 방향 열전도도가 최대를 만족하는 최적의 Cu film 배치 조합이 도출되었다. 도출된 배치 조합은 투입될 수 있는 Cu film의 수량이 적어질수록 단순한 배치 형태를 나타내었으며, 수량이 많아질수록 세밀한 배치를 보였다. Cu film의 배치 수량에 따라 생성된 최적 조합들은 두께 방향으로의 고유 열전도 경로를 나타내었으며, Cu film의 횡방향 배치 자유도가 두께 방향 열전도도 결과에 민감하게 나타날 수 있음을 보였다.
Abstract
This study proposes a hybrid composite where a thin copper film (Cu film) is embedded in carbon fiber reinforced plastic (CFRP), and quantum annealing is applied to derive the combination of Cu film placement that maximizes the through-thickness thermal conductivity. The correlation between each ply of CFRP and the Cu film is analyzed through finite element analysis, and based on the results, a combination optimization problem is formulated. A formalization process is conducted to embed the defined problem into quantum annealing, resulting in the formulation of objective functions and constraints regarding the quantity of Cu films that can be inserted into each ply of CFRP. The formulated equations are programmed using Ocean SDK (Software Development Kit) and Leap to be embedded into D-Wave quantum annealer. Through the quantum annealing process, the optimal arrangement of Cu films that satisfies the maximum through-thickness thermal conductivity is determined. The resulting arrangements exhibit simpler patterns as the quantity of insertable Cu films decreases, while more intricate arrangements are observed as the quantity increases. The optimal combinations generated according to the quantity of Cu film placement illustrate the inherent thermal conductivity pathways in the thickness direction, indicating that the transverse placement freedom of the Cu film can significantly affect the results of through-thickness thermal conductivity.
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