OSP•ENIG 표면 처리된 기판과 Sn-3.0Ag-0.5Cu 솔더 접합부의 낙하충격 신뢰성 평가
Drop reliability evaluation of Sn-3.0Ag-0.5Cu solder joint with OSP and ENIG surface finishes
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초록
전자 기기 제품들이 소형화 및 휴대화 되면서 낙하충격 신뢰성에 대한 관심이 높아지고 있다. 본 연구에서는 대표적인 무연솔더인Sn-3.0Ag-0.5Cu솔더를 이용하여 ENIG (Electroless Nickel Iimmersion Gold), OSP (Organic Solderability Preservative) 표면 처리와 등온 시효 시험 (High Temperature Storage test)에 따른 보드 레벨 패키지 (board level package)의 낙하충격 신뢰성 (drop reliability) 시험을 수행하였다. 또한 충격 조건을 변화시켜 시편에 가해지는 가속도 (G:acceleration)와 충격 지속 시간 (pulse duration)에 따른 신뢰성을 평가하였다. 기판의 strain측정 결과 중앙 부위가 가장 응력이 컸으며, 충격가속도에 비례하여 응력이 증가하였다. 시효 처리 전에는 OSP처리된 기판이 다소 우수한 신뢰성을 보였지만, 시효 처리후에는 ENIG기판에서 신뢰성이 우수하였고, 반대로 OSP는 감소하는 경향을 보였다. OSP의 경우 과도한 금속간화합물 (intermetallic compound)의 성장으로 인해 접합 계면에서 취성파괴 (brittle fracture)가 일어난 것을 관찰할 수 있었다.
Abstract
The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.
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