가압소결온도에 따른 p형 (Bi_(0.2)Sb_(0.8)₂Te₃가압소결체의 열전특성
Thermoelectric Properties of the p-type (Bi_(0.2)Sb_(0.8)₂Te₃with Variation of the Hot-Pressing Temperature
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초록
p형 (Bi_(0.2)Sb_(0.8)₂Te₃분말을 기계적 합금화 공정으로 제조하여 가압소결 후 가압소결온도에 따른 열전특성을분석하였다. 가압소결온도를 350℃에서 550℃로 증가시킴에 따라 상온에서 측정한 Seebeck 계수가 237 μV/K에서210 μV/K로 감소하고 전기비저항이 2.25 mΩ-cm에서 1.34 mΩ-cm로 감소하였으며, power factor가 25.0×10^(-4)W/m-K²에서 32.9×10^(-4) W/m-K²로 증가하였다. 350~550℃의 온도범위에서 가압소결한 시편들 중에서, 500℃에서 가압소결한(Bi_(0.2)Sb_(0.8)₂Te₃가압소결체가 상온에서 1.09 및 75℃에서 1.2의 가장 높은 무차원 성능지수를 나타내었다.
Abstract
The p-type(Bi_(0.2)Sb_(0.8)₂Te₃powers were fabricated by mechanical alloying and hot-pressed at temperatures of 350~550℃. Themoelectric properties of the hot-pressed (Bi_(0.2)Sb_(0.8)₂Te₃were characterized as a function of the hotpressing temperature. With increasing the hot-pressing temperature from 350℃to 550℃, the Seebeck coefficient and the electrical resistivity decreased from 237 μV/K to 210 μV/K and 2.25 mΩ-cm to 1.34 mΩ-cm, respectively. The power factor of the hot-pressed (Bi_(0.2)Sb_(0.8)₂Te₃became larger from 25.0×10^(-4)W/m-K² to 32.9×10^(-4) W/m-K² with increasing the hot-pressing temperature from 350℃ to 550℃. Among the specimens hot-pressed at 350~550℃, the (Bi_(0.2)Sb_(0.8)₂Te₃hot-pressed at 500℃ exhibited the maximum dimensionless figure-of-merit of 1.09 at 25℃ and 1.2 at 75℃.
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