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신축 전자패키지 배선용 금속박막의 신축변형-저항 특성 II. Au, Pt 및 Cu 박막의 특성 비교

Stretchable Deformation-Resistance Characteristics of Metal Thin Films for Stretchable Interconnect Applications II. Characteristics Comparison for Au, Pt, and Cu Thin Films

오태성|박동현
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2017.09|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제24권 제3호|pp. 19-26

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참고문헌

키워드

PDMSstretchable packagingstretchable interconnectmetal thin filmparylene
주제분류재료공학

초록

Polydimethylsiloxane (PDMS) 기판과 금속박막 사이의 중간층으로 parylene F를 사용한 신축패키지 구조에서Au, Pt, Cu 박막의 신축변형에 따른 저항변화를 분석하였다. Parylene F 중간층을 코팅한 PDMS 기판에 스퍼터링한150 nm 두께의 Au 박막과 Pt 박막은 각기 1.56 Ω 및 5.53 Ω의 초기저항을 나타내었으며, 30% 인장변형률에서 각 박막의 저항증가비 ΔR/R o은 각기 7 및 18로 측정되었다. Cu 박막은 18.71 Ω의 높은 초기저항을 나타내었으며 인장변형에 따라 저항이 급격히 증가하다 5% 인장변형률에서 open 되어, Au 박막과 Pt 박막에 비해 매우 열등한 신축 특성을 나타내었다.

Abstract

Stretchable deformation-resistance characteristics of Au, Pt, and Cu films were measured for the stretchable packaging structure where a parylene F was used as an intermediate layer between a PDMS substrate and a metal thin film. The 150 nm-thick Au and Pt films, sputtered on the parylene F-coated PDMS substrate, exhibited the initial resistances of 1.56 Ω and 5.53 Ω, respectively. The resistance increase ratios at 30% tensile strain were measured as 7 and 18 for Au film and Pt film, respectively. The 150 nm-thick Cu film, sputtered on the parylene F-coated PDMS substrate, exhibited a very poor stretchability compared to Au and Pt films. Its resistance was initially 18.71 Ω, rapidly increased with applying tensile deformation, and finally became open at 5% tensile strain.

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