NCP 적용 COB 플립칩 패키지의 신뢰성 연구
Study on the Reliability of COB Flip Chip Package using NCP
1
조회
0
다운로드
2
인용
0
참고문헌
키워드
초록
COB(chip-on-board) 플립칩 패키지에 있어서 NCP(non-conductive paste)의 적용성을 확보하기 위해 자체 포 뮬레이션한 NCP와 상용 NCP에 대하여 보드레벨 플립칩 패키지를 제작하고 고온고습 및 열충격 신뢰성을 평가하였다. 실험결과 보다 작은 입도의 용융 실리카를 첨가한 NCP 시제품들이 고온고습 신뢰성에 유리한 것을 알 수 있었다. 또한, NCP 접속부에 있어서 열응력에 의한 피로보다 흡습에 의한 에폭시의 팽창이 접속부 파손에 보다 큰 영향을 미치는 것으 로 나타났으며, NCP의 접착강도가 높을수록 NCP 플립칩 패키지의 열충격 신뢰성이 향상되는 것을 알 수 있었다.
Abstract
High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.
참고문헌 (8)
- Horatio Quinones, "Reliability statistics for flip chip and CSP interconnection", IMAPS Nordic, pp.1~8 (1999)
- Paul S. Ho, "Reliability issues for flip-chip packages", Microelectronics Reliability, 44(5), pp.719~737 (2004)
- K. W. Paik, "Anisotropic conductive flim for flip chip package", Journal of the KSME, 45(6), pp.57~63 (2005)
- 노보인, "비전도성 접착제가 사용된 플립칩 패키지의 신뢰성에 관한 연구", 마이크로전자 및 패키징학회지, 14(4), pp.9~14 (2007), 한국마이크로전자및패키징학회
- John Liu, "ACA bonding technology for low cost electronics packaging applications - current status and remaining challenges", Journal of Soldering & Surface Mount Technology, 13(3), pp.39~57 (2001)
- S.C. TAN, "Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications", Journal of Electronic Materials, 34(8), pp.1143~1149 (2005)
- Chin-Lung Chiang, "Thermo-oxidative degradation of novel epoxy containing silicon and phosphorous nanocomposites", European Polymer Journal, 39(4), pp.825~830 (2003)
- Maksim Antonov, "Thermophysical properties and thermal shock resistance of chromium carbide based cermets", Proc. Estonian Acad. Sci. Eng., 12(4), pp.358~367 (2006)