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고열유속 소자를 위한 칩 레벨 액체 냉각 연구

Study of Chip-level Liquid Cooling for High-heat-flux Devices

김은경|김성동|박만석
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2015.06|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제22권 제2호|pp. 27-31|DOI http://dx.doi.org/10.6117/kmeps.2015.22.2.027

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참고문헌

키워드

TSVMicrochannelHeat FluxLiquid CoolingThermal Management
주제분류재료공학

초록

고성능 소자의 전력밀도가 증가함에 따라 소자의 열 관리는 주요 핵심 기술로 부각되었고, 기존의 heat sink 나 TIM(thermal interface material)으로는 소자의 열 문제를 해결하는데 한계가 있다. 이에 최근에는 열 유속(heat flux) 을 증가시키고자 액체 냉각 시스템에 관한 연구가 활발히 진행되고 있으며, 본 연구에서는 TSV(through Si via)와microchannel을 이용하여 칩 레벨 액체 냉각 시스템을 제작하고 시스템의 냉각 특성을 분석하였다. TSV와microchannel은 Si 웨이퍼에 DRIE(deep reactive ion etching)을 이용하여 공정하였고, 3가지 다른 형상의 TSV를 제작하여 TSV 형상이 냉각 효율에 미치는 영향을 분석하였다. TSV와 microchannel 내 액체흐름 형상은 형광현미경으로관찰하였고, 액체 냉각에 대한 효율은 실온에서 300oC까지 시편을 가열하면서 적외선현미경을 이용하여 온도를 측정분석하였다.

Abstract

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to 300oC.

참고문헌 (22)

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