다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향
Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni- B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
Abstract
The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni- B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
참고문헌 (11)
- ITRPV, "International Technology Roadmap for Photovoltaic (ITRPV), Results 2015, Seventh Edition", 2~19 (2016)
- A. Bidiville, "Diamond Wire-Sawn Silicon Wafers from the Lab to the Cell Production", Proceedings of 24th European Photovoltaic Solar Energy Conference and Exhibition, pp.1297~1302 (2009)
- H. Li, "XPS studies on surface electronic characteristics of Ni-B and Ni-P amorphous alloy and its correlation to their catalytic properties", Appl. Surf. Sci, 152, pp.25~34 (1999)
- 안종관, "무전해 니켈 도금법으로 제조된 니켈-다이아몬드 복합분체의 특성", 한국분말야금학회지, 11(3), pp.233~241 (2004), 한국분말야금학회
- M. Paunovic, "Fundamentals of Electrochemical Deposition", pp.153~155 (2006), John Wiley
- G. O. Mallory, "Electroless Plating, William Andrew", pp.88~93 (1990), AESF
- C. R. Lee, "A study on Electroless Ni-B Plating with DMAB as Reducing Agent", J. Korean inst. surf. Eng, 32(2), pp.172~181 (1999)
- T. Watanabe, "Nano-Plating", pp.659~664 (2004), Elsevier
- 추현식, "CBN분말상에 석출형상 제어를 위한 무전해 기능성 니켈합금도금에 관한 연구", 한국표면공학회지, 41(6), pp.312~324 (2008), 한국표면공학회
- S. Q. Guo, "Characteristics and corrosion behavior of nickelphosphorus coatings deposited by a simplified bath", Mater. Corros, 4, pp.68~ (2017)
- Q. L. Rao, "Microstructure evolution of electroless Ni-B film during its deposition process", Appl. Surf. Sci, 240, pp.28~33 (2005)