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직접 접합 셀의 ECA 경화조건에 따른 구조적/전기적 특성 개선

Improvement of Structural/Electrical Properties According to ECA Curing Conditions of Direct Bonding Cell

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초록

Currently, in the manufacturing of solar modules, there is a limit to large-scale expansion and reduction of raw material usage to reduce module cost. Therefore, research is being conducted to increase the efficiency by changing the module to a shingled structure , rather than increasing the efficiency of the cell unit. In this paper, we analyzed the characteristics of the solar cell by optimizing the bonding cell process of the shingled module structure using an acrylic-based series electrically conductive adhesive (ECA). The experimental conditions were as follows: the curing temperature of the ECA ranged from 130 to 190°C and the curing time ranged from 30 to 180 s. It was confirmed that the efficiency was reduced compared to the existing cutting cell when the curing temperature and curing time ranged from 130 to 150°C and 30 to 60 s, respectively. This is because the lubricating oil component did not decompose owing to the short curing time and low curing temperature. Based on the curing temperature of 170 to 190°C and a curing time of 90 s, the efficiency decreased to less than 0.6%. This is because when the adhesive components of the ECA acrylic-based series are exposed to certain curing conditions, they expand and the silver particles are cracked. A smooth current path was formed when the curing temperature and curing time was 150°C and 150 s, respectively, confirming the highest efficiency of 0.823%. Consequently, for a curing temperature of 150°C and a curing time of 150 s, the lubricating oil components that existed between the silver particles, which are the main components of the ECA, were smoothly decomposed. In addition, through the reduction of the resistance of the ECA and the formation of a smooth current path, a high efficiency of 0.823% was confirmed.

Abstract

Currently, in the manufacturing of solar modules, there is a limit to large-scale expansion and reduction of raw material usage to reduce module cost. Therefore, research is being conducted to increase the efficiency by changing the module to a shingled structure , rather than increasing the efficiency of the cell unit. In this paper, we analyzed the characteristics of the solar cell by optimizing the bonding cell process of the shingled module structure using an acrylic-based series electrically conductive adhesive (ECA). The experimental conditions were as follows: the curing temperature of the ECA ranged from 130 to 190°C and the curing time ranged from 30 to 180 s. It was confirmed that the efficiency was reduced compared to the existing cutting cell when the curing temperature and curing time ranged from 130 to 150°C and 30 to 60 s, respectively. This is because the lubricating oil component did not decompose owing to the short curing time and low curing temperature. Based on the curing temperature of 170 to 190°C and a curing time of 90 s, the efficiency decreased to less than 0.6%. This is because when the adhesive components of the ECA acrylic-based series are exposed to certain curing conditions, they expand and the silver particles are cracked. A smooth current path was formed when the curing temperature and curing time was 150°C and 150 s, respectively, confirming the highest efficiency of 0.823%. Consequently, for a curing temperature of 150°C and a curing time of 150 s, the lubricating oil components that existed between the silver particles, which are the main components of the ECA, were smoothly decomposed. In addition, through the reduction of the resistance of the ECA and the formation of a smooth current path, a high efficiency of 0.823% was confirmed.

참고문헌 (13)

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  3. Theunissen, L., "Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology", 1999AIP Conference Proceedings, pp.080003-1~080003-6 (2018)
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  5. Sanchari Chowdhury, "Analysis of Cell to Module Loss Factor for Shingled PV Module", 신재생에너지, 16(3), pp.1~12 (2020), 한국신·재생에너지학회[DOI]
  6. Tonini, D., "Shingling Technology for Cell Interconnection: Technological Aspects And Process Intergration", Energy Procedia, pp.36~43 (2018)
  7. 조현수, "Photovoltaic Modules Using a Galinstan Paste Interconnection", Journal of the Korean Physical Society, 74(12), pp.1184~1189 (2019), 한국물리학회[DOI]
  8. Eiternick, S., "High Quality Half-cell Processing Using Thermal Laser Separation", Energy Procedia, 77, pp.340~345 (2015)
  9. Geipel, T., "Optimization of Electrically Conductive Adhesive Bonds in Photovoltaic Modules", IEEE Journal of Photovoltaics, 8(4), pp.1074~1081 (2018)
  10. Wang, X. Q., "Effect of Curing Agent and Curing Substrate on Low Temperature Curable Silver Conductive Adhesive", Journal of Materials Science: Materials in Electronics, 30(3), pp.2829~2836 (2019)
  11. Lim, J. R., "Analytical Study of the Electrical Output Characteristics of c-Si Solar Cells by Cut and Shading Phenomena", Energies, 11(12), pp.3397~ (2018)
  12. Jee, H. S., "Electrically Conductive Adhesives and the Shingled Array Cell for High Density Modules", Journal of Nanoscience and Nanotechnology, 19, pp.1360~1363 (2019)
  13. Park, J., "Analysis of Solar Cells Interconnected by Electrically Conductive Adhesives for High-density Photovoltaic Modules", Applied Surface Science, 484, pp.732~739 (2019)

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